A Dielectrically Isolated SLIC-LSI Using Si-B-O Bonding Process
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: ECS Proceedings Volumes
سال: 1989
ISSN: 0161-6374,2576-1579
DOI: 10.1149/198915.0261pv